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SK hynix eyes Q4 rollout of 12-layer HBM4 as it locks in Nvidia supply deal  25/05/30
SK hynix plans to begin mass production of 12-layer HBM4 chips in the fourth quarter of 2025, supplying initial volumes to Nvidia once Rubin’s launch timeline and order size are confirmed.
Samsung to end MLC NAND business   25/05/27
With the ending of MLC NAND production, Samsung will likely focus its resources on triple level cell (TLC) and quad level cell (QLC) NANDs.?
SK hynix's US sales make up over 70% in Q1 on rising AI demand  25/05/16
Chip giant SK hynix has reported that its U.S. sales accounted for over 70 percent of its total revenue in the first quarter on rising demand for premium high bandwidth memory (HBM) chips from major U.S. tech companies.
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Market Cap Gap Between TSMC, Samsung Electronics Widens to 2.5 Times
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Notice of New Year's Day Holiday
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SK hynix Actively Recruits Intel Experts to Boost NAND Flash Memory Leadership
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Samsung Delays Mass Production at New Texas Fab to 2025
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