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SK hynix eyes Q4 rollout of 12-layer HBM4 as it locks in Nvidia supply deal　 25/05/30
SK hynix plans to begin mass production of 12-layer HBM4 chips in the fourth quarter of 2025, supplying initial volumes to Nvidia once Rubin’s launch timeline and order size are confirmed.
Samsung to end MLC NAND business 　 25/05/27
With the ending of MLC NAND production, Samsung will likely focus its resources on triple level cell (TLC) and quad level cell (QLC) NANDs.?
SK hynix's US sales make up over 70% in Q1 on rising AI demand　 25/05/16
Chip giant SK hynix has reported that its U.S. sales accounted for over 70 percent of its total revenue in the first quarter on rising demand for premium high bandwidth memory (HBM) chips from major U.S. tech companies.
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2019-03-28
GlobalWafers supply of 8- and 12-inch wafers remains tight
2019-03-26
Advanced packaging to generate nearly US$3 billion in revenues in 2019, says TSMC chairman
2019-03-26
Recovery to take place in non-memory IC market starting 2Q19, says TSMC chairman
2019-03-25
Compal to see worsening supply gap in 2Q19
2019-03-25
Compal expects double-digit growths in server business in 2019 and 2020
2019-03-21
PCIe SSD rising as mainstream, to grab 50% market share in 2019
2019-03-19
Sony Mobile revises downward fiscal 2018 smartphone shipment target
2019-03-19
Number of 300mm wafer fabs to grow through 2023, says IC Insights
2019-03-19
TSMC seeing chip orders for Android devices ramp up
2019-03-18
Intel to start engineering projects for 5G modem chips in 2Q19, say sources
2019-03-15
Qualcomm, USI and Asustek team up in Brazil
2019-03-15
Global large-size panel output to grow 12% in 2019
2019-03-13
Global fab spending to fall in 2019 but rise to set new record in 2020, says SEMI
2019-03-13
Foxconn challenges Microsoft patent lawsuit
2019-03-12
Intel surpasses Samsung in semiconductor sales revenue, IHS says

 
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