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SK hynix eyes Q4 rollout of 12-layer HBM4 as it locks in Nvidia supply deal　 25/05/30
SK hynix plans to begin mass production of 12-layer HBM4 chips in the fourth quarter of 2025, supplying initial volumes to Nvidia once Rubin’s launch timeline and order size are confirmed.
Samsung to end MLC NAND business 　 25/05/27
With the ending of MLC NAND production, Samsung will likely focus its resources on triple level cell (TLC) and quad level cell (QLC) NANDs.?
SK hynix's US sales make up over 70% in Q1 on rising AI demand　 25/05/16
Chip giant SK hynix has reported that its U.S. sales accounted for over 70 percent of its total revenue in the first quarter on rising demand for premium high bandwidth memory (HBM) chips from major U.S. tech companies.
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2018-12-21
IBM expands tie-up with Samsung to include 7nm chip manufacturing
2018-12-21
TSMC advises fabless clients to place orders with multiple fabs
2018-12-14
Unisoc has ambitious plans for 5G
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Asustek shakeup: Q&A with company chairman Jonney Shih and president Jerry Shen
2018-12-13
Qualcomm unveils 5G platform to test market
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UMC to spend NT$27 billion on capacity deployment
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NAND flash price rebound to be short-lived
2018-12-11
Notebook ODMs see low order visibility for 1H19 on Intel CPU shortages
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China court bans sales of older iPhone models in Apple-Qualcomm global battle
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New Qualcomm chip to power smartphones slated for launch in 1H19

 
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