Recommended Hot News
Kioxia developing 100 million IOPS SSD for Nvidia  25/09/16
Kioxia is working with Nvidia to build extremely fast AI SSDs to augment high-bandwidth memory (HBM) by being directly connected to GPUs, with 2027 availability.
NVIDIA Reportedly Shifts Strategy: Focus Moves to SOCAMM2  25/09/15
The abandonment of SOCAMM1, if accurate, resets what was expected to be a fast-tracked rollout of modular LPDDR-based memory in Nvidia’s data center stack. SOCAMM has been positioned as a new class of high-bandwidth, low-power memory for AI servers, delivering similar benefits to HBM but at a lower cost.
Samsung Electronics Prepares to Build Pyeongtaek Plant 5  25/09/08
Samsung Electronics aims to expand HBM supply with the P5 groundbreaking.
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2024-12-24
SK Hynix wins large order for HBM from Broadcom
2024-12-19
Samsung Electronics to Establish Test Line for 7th Generation DRAM at 10nm Level
2024-12-09
Samsung Completes Development of Groundbreaking 400-layer NAND Technology
2024-12-09
CXL Consortium Announces Compute Express Link 3.2 Specification Release
2024-12-06
SK Hynix beefs up executive team amid high number of promotions
2024-12-03
Korea’s Nov. exports up 1.4% on solid chip demand
2024-11-26
Samsung succeeds in reducing use of PR during 3D NAND lithography
2024-11-25
Nvidia CEO signals Samsung’s imminent shipment of HBM3E
2024-11-20
Tesla asks Samsung, SK Hynix to supply HBM4 chip samples
2024-11-20
Samsung Electronics Expands Packaging Facilities in Suzhou
2024-11-12
Samsung Electronics to expand chip packaging facilities for HBM
2024-11-08
KIOXIA invests $230 million to develop CXL power-saving memory for AI
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Samsung Electronics' Pingze P4 plans to simultaneously mass produce NAND and DRAM
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KIOXIA is seeking an IPO before June next year and is still exploring the possibility of going public within this year
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SK Hynix to provide HBM3E 16H samples in early 2025

 

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