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Samsung in Talks with Broadcom to Supply 12-layer HBM3E, Estimated Volume Reaches 1 Billion Gb  25/07/04
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
Samsung 6th-Gen DRAM Receives Production Readiness Approval  25/07/02
Samsung Electronics achieved a significant technological milestone by securing production readiness approval for its sixth-generation DRAM technology.
SK hynix considering building new back-end process plant in S. Korea  25/06/24
SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
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2017-07-21
Moto Z2 Force To Feature Very Thin Body And Small Battery
2017-07-20
UFS-based NAND flash solutions to become mainstream storage technology for mobile devices
2017-07-20
Xiaomi Introduces Its Cheapest 32-inch Smart TV
2017-07-20
Unigroup Guoxin scraps plan to acquire Yangtze Memory
2017-07-20
Upcoming Meizu Pro 7 series reportedly to utilize MediaTek chips
2017-07-20
TSMC InFO packaging brings more competitiveness to its 7nm process technology
2017-07-20
Samsung To Recycle 157 Tons Of Resources From Recalled Galaxy Note 7 Units
2017-07-20
HMD Global Loses CEO Before Nokia 8 Launch
2017-07-20
Nokia 8 Accidentally Revealed On Official Website
2017-07-20
New Color Option For Galaxy S8 And S8+ Coming To The US Tomorrow
2017-07-19
Prices of NAND Flash rose by 26% in the first half of 2017 while the prices of the second half will depend on the output of 3D NAND from Flash vendors
2017-07-19
IC Insights predicts record annual ASP growth rates for DRAM, NAND flash
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