Recommended Hot News
Kioxia Sampling UFS Ver. 4.1 Embedded Flash Memory Devices  25/07/11
With a blend of speed and low power use, Kioxia’s UFS Ver. 4.1 devices are built to enhance user experiences—enabling faster downloads and smoother app performance.
Samsung in Talks with Broadcom to Supply 12-layer HBM3E, Estimated Volume Reaches 1 Billion Gb  25/07/04
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
Samsung 6th-Gen DRAM Receives Production Readiness Approval  25/07/02
Samsung Electronics achieved a significant technological milestone by securing production readiness approval for its sixth-generation DRAM technology.
To view news
2024-07-22
SEMI Calls for Unified Standards in Chip Packaging and Backend Processes
2024-07-19
TSMC's Q2 2024 Earnings Call Highlights and Future Outlook
2024-07-18
GlobalWafers Receives $400 Million U.S. Funding for Semiconductor Wafer Production
2024-07-18
TSMC Forecasts Record Q3 Revenue and Significant Increase in 2024 Capital Expenditure
2024-07-17
Samsung to mass-produce HBM4 on 4 nm foundry process
2024-07-17
OPENEDGES Successfully Validated Its 7nm HBM3 Testchip
2024-07-16
HBM3E 12-Layer Product Emerges as a Key Player in the AI Semiconductor Market
2024-07-15
South Korea's Storage Chip Exports Surge 85.2% YoY in June, Reaching $8.83 Billion
2024-07-12
Semiconductor Equipment Sales to Reach Record Highs in 2024 and 2025
2024-07-12
AI-Driven Demand Sparks HBM Production Capacity Race Among Leading Chipmakers
2024-07-10
KCTech’s supercritical cleaner being evaluated for SK Hynix’s DRAM line
2024-07-09
Samsung and SK Hynix Explore Laser Technology to Improve HBM Wafer Processing
2024-07-08
Global Semiconductor Sales Surge by Nearly 20% in May, Reaching $49.1 Billion
2024-07-05
Samsung launches dedicated HBM, advanced chip packaging teams
2024-07-03
Samsung applies molybdenum in Gen 9 V-NAND

 

Price Trend
Stock Information
Update: 07-16 10:43,Data has delay
Samsung KRW 64300 +0.94%
SK Hynix KRW 294500 -1.34%
KIOXIA JPY 2489 +1.59%
Micron USD 120.110 +1.26%
WDC USD 67.530 +0.90%
SanDisk USD 42.720 +0.56%
Nanya TWD 41.80 +0.12%
Winbond TWD 17.80 -0.56%
Phison TWD 508 +2.63%
SMI USD 71.170 -1.71%
Maxio CNY 41.72 +3.86%
ASolid TWD 53.0 +2.71%
Longsys CNY 82.85 +1.22%
Seagate USD 149.050 -0.02%
Innodisk TWD 230.0 -1.08%
Transcend TWD 91.3 -0.22%
A-DATA TWD 92.5 +1.98%
PENG USD 24.840 +0.57%
Netac CNY 23.83 +0.97%
BWCC CNY 64.86 -0.02%
Techwinsemi CNY 84.23 +1.53%
DAWEI CNY 17.17 +1.48%
OSE TWD 38.75 +0.65%
PTI TWD 141.0 +3.30%
JCET CNY 33.82 +0.54%
ASE TWD 153.0 +1.66%
TFME CNY 26.20 +2.30%
HT-tech CNY 9.90 +1.12%