Recommended Hot News
Samsung in Talks with Broadcom to Supply 12-layer HBM3E, Estimated Volume Reaches 1 Billion Gb  25/07/04
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
Samsung 6th-Gen DRAM Receives Production Readiness Approval  25/07/02
Samsung Electronics achieved a significant technological milestone by securing production readiness approval for its sixth-generation DRAM technology.
SK hynix considering building new back-end process plant in S. Korea  25/06/24
SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
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2019-10-25
Intel Gives Bullish Forecast on Data-Center Chip Demand
2019-10-25
South Korea’s Semiconductor Industry Close to Seeing the Light at the End of the Tunnel
2019-10-25
Micron debuts wicked fast 3D XPoint SSD, goes toe-toe with Intel Optane
2019-10-24
Nokia cuts full-year profit outlook on tough competition
2019-10-24
SK hynix Reports Third Quarter 2019 Results
2019-10-22
Kingston Technology Releases Enterprise-Grade Data Center 450R SSD
2019-10-22
Samsung Electronics and SK Hynix Differently Affected by U.S. Restrictions on Huawei
2019-10-21
SK hynix Develops 1Znm 16Gb DDR4 DRAM
2019-10-18
Samsung Expands its Commitment to Foundry Customers with the First ‘SAFE Forum 2019’
2019-10-18
Samsung Electronics to Produce Application Processor for Facebook’s Augmented Reality Glasses
2019-10-17
TSMC third-quarter profit rises 13.5%, beats market forecasts
2019-10-15
Samsung, LG struggle in phone components
2019-10-15
Samsung Electronics’ Stock Price Surpasses 50,000 Won for First Time in 16 Months
2019-10-15
South Korea’s Proposal Approved as International Big Data Standard
2019-10-08
Micron:128-Layer 4th 3D NAND with RG Architecture Coming Soon

 

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