Recommended Hot News
Samsung in Talks with Broadcom to Supply 12-layer HBM3E, Estimated Volume Reaches 1 Billion Gb  25/07/04
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
Samsung 6th-Gen DRAM Receives Production Readiness Approval  25/07/02
Samsung Electronics achieved a significant technological milestone by securing production readiness approval for its sixth-generation DRAM technology.
SK hynix considering building new back-end process plant in S. Korea  25/06/24
SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
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2019-03-19
TSMC seeing chip orders for Android devices ramp up
2019-03-18
Intel to start engineering projects for 5G modem chips in 2Q19, say sources
2019-03-15
Qualcomm, USI and Asustek team up in Brazil
2019-03-15
Global large-size panel output to grow 12% in 2019
2019-03-13
Global fab spending to fall in 2019 but rise to set new record in 2020, says SEMI
2019-03-13
Foxconn challenges Microsoft patent lawsuit
2019-03-12
Intel surpasses Samsung in semiconductor sales revenue, IHS says
2019-03-12
TSMC likely to post first annual profit drop in 8 years
2019-03-12
NVIDIA to Acquire Mellanox Technology for $6.9 Billion
2019-03-11
MediaTek February revenues slip to 1-year low
2019-03-11
Apple faces pressure over foldable phones
2019-03-05
Chipmakers to scale up 96-layer 3D NAND flash output in 2Q19
2019-03-05
Intel Takes Steps to Enable Thunderbolt 3 Everywhere, Releases Protocol
2019-03-04
DRAM price falls to slow, says Nanya
2019-02-27
Competition in foldable smartphone market heating up

 

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Stock Information
Update: 07-11 00:31,Data has delay
Samsung KRW 61000 +0.99%
SK Hynix KRW 297000 +5.69%
KIOXIA JPY 2557 -5.58%
Micron USD 123.350 +0.91%
WDC USD 65.105 +0.72%
SanDisk USD 47.220 +2.21%
Nanya TWD 47.15 -2.58%
Winbond TWD 18.50 -2.37%
Phison TWD 493.0 +1.44%
SMI USD 74.900 +0.25%
Maxio CNY 40.48 +0.40%
ASolid TWD 51.4 -0.19%
Longsys CNY 80.53 -1.77%
Seagate USD 145.430 +2.41%
Innodisk TWD 242.0 -0.21%
Transcend TWD 96.9 -3.00%
A-DATA TWD 94.7 -2.57%
PENG USD 23.750 +1.37%
Netac CNY 23.31 -1.69%
BWCC CNY 65.71 +1.09%
Techwinsemi CNY 83.10 -4.25%
DAWEI CNY 17.57 -1.95%
OSE TWD 37.55 +0.27%
PTI TWD 135.5 -0.73%
JCET CNY 33.08 -0.30%
ASE TWD 150.0 +2.39%
TFME CNY 24.91 -0.20%
HT-tech CNY 9.77 +0.10%