Recommended Hot News
Samsung in Talks with Broadcom to Supply 12-layer HBM3E, Estimated Volume Reaches 1 Billion Gb  25/07/04
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
Samsung 6th-Gen DRAM Receives Production Readiness Approval  25/07/02
Samsung Electronics achieved a significant technological milestone by securing production readiness approval for its sixth-generation DRAM technology.
SK hynix considering building new back-end process plant in S. Korea  25/06/24
SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
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2019-02-19
Global Foundries, the World's 3rd Largest Foundry, May Be Sold
2019-02-19
TSMC Revises Financial Outlook, Accounts for January Chemical Contamination and Lost Silicon
2019-02-15
Global notebook shipments to fall 13% in 1Q19
2019-02-15
SMIC expects revenues to hit bottom in 1Q19
2019-02-15
TSMC gearing up for 7nm chip production for Qualcomm
2019-02-14
1TB SSD prices fall over 50% since 2018
2019-02-14
200mm fabs to add 700,000 wafers through 2022, says SEMI
2019-02-14
SMART Modular Announces New N200 Family of SATA Flash Products
2019-02-13
Global semiconductor sales increase 13.7% in 2018, says SIA
2019-02-13
Shipments of 3D sensing-enabled Android smartphones to boom
2019-02-13
MediaTek to see revenues rebound in 2Q19
2019-02-13
TSMC 7nm EUV Process to Enter Mass-Production in March 2019
2019-02-12
Nanya January revenues down, Winbond up
2019-02-12
Four China firms among top 10 chip buyers in 2018, Gartner says
2019-02-12
TSMC to move 7nm EUV process to volume production in March

 

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Update: 07-11 01:49,Data has delay
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