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Samsung in Talks with Broadcom to Supply 12-layer HBM3E, Estimated Volume Reaches 1 Billion Gb  25/07/04
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
Samsung 6th-Gen DRAM Receives Production Readiness Approval  25/07/02
Samsung Electronics achieved a significant technological milestone by securing production readiness approval for its sixth-generation DRAM technology.
SK hynix considering building new back-end process plant in S. Korea  25/06/24
SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
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2018-12-26
Huawei to be first to adopt TSMC EUV process, says report
2018-12-26
Macronix, IBM extend partnership
2018-12-26
Huawei ships over 200 million handsets in 2018
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Unisoc has ambitious plans for 5G
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Update: 07-10 17:19,Data has delay
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SK Hynix KRW 297000 +5.69%
KIOXIA JPY 2557 -5.58%
Micron USD 122.240 -1.75%
WDC USD 64.640 +0.97%
SanDisk USD 46.200 +0.06%
Nanya TWD 47.15 -2.58%
Winbond TWD 18.50 -2.37%
Phison TWD 493.0 +1.44%
SMI USD 74.710 +3.28%
Maxio CNY 40.48 +0.40%
ASolid TWD 51.4 -0.19%
Longsys CNY 80.53 -1.77%
Seagate USD 142.010 -1.70%
Innodisk TWD 242.0 -0.21%
Transcend TWD 96.9 -3.00%
A-DATA TWD 94.7 -2.57%
PENG USD 23.430 +10.57%
Netac CNY 23.31 -1.69%
BWCC CNY 65.71 +1.09%
Techwinsemi CNY 83.10 -4.25%
DAWEI CNY 17.57 -1.95%
OSE TWD 37.55 +0.27%
PTI TWD 135.5 -0.73%
JCET CNY 33.08 -0.30%
ASE TWD 150.0 +2.39%
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