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Samsung in Talks with Broadcom to Supply 12-layer HBM3E, Estimated Volume Reaches 1 Billion Gb  25/07/04
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
Samsung 6th-Gen DRAM Receives Production Readiness Approval  25/07/02
Samsung Electronics achieved a significant technological milestone by securing production readiness approval for its sixth-generation DRAM technology.
SK hynix considering building new back-end process plant in S. Korea  25/06/24
SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
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2018-12-13
Intel Launches B365 Express Chipset on 22nm Process, Possibly a Re-branded Z170
2018-12-12
TSMC to expand 8-inch fab capacity for robust demand for automotive, IoT
2018-12-12
NAND flash price rebound to be short-lived
2018-12-11
Notebook ODMs see low order visibility for 1H19 on Intel CPU shortages
2018-12-11
MediaTek revenues fall to 9-month low in November
2018-12-11
China court bans sales of older iPhone models in Apple-Qualcomm global battle
2018-12-07
New Qualcomm chip to power smartphones slated for launch in 1H19
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TSMC to build new 8-inch fab capacity
2018-12-07
Intel 7nm EUV Node Back On Track, 2x Transistor Densities Over 10nm
2018-12-06
US telecom operators to roll out 5G services in 1Q19, says Qualcomm president
2018-12-06
Samsung Display to shift one 8.5G LCD fab for QD-OLED panels in mid-2019
2018-12-05
ASML says fire at supplier Prodrive will lead to delays early next year
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Global semiconductor sales increase in October, says SIA
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