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Samsung in Talks with Broadcom to Supply 12-layer HBM3E, Estimated Volume Reaches 1 Billion Gb  25/07/04
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
Samsung 6th-Gen DRAM Receives Production Readiness Approval  25/07/02
Samsung Electronics achieved a significant technological milestone by securing production readiness approval for its sixth-generation DRAM technology.
SK hynix considering building new back-end process plant in S. Korea  25/06/24
SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
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2018-11-21
SiP emerging as mainstream packaging process in 5G, AIoT era
2018-11-20
Tsinghua and Longsys team up for NAND flash
2018-11-19
Handset brands gearing up efforts to expand share in India
2018-11-16
Intel Cutting Retail Processor Supply for Holiday 2018
2018-11-14
Yangtze Memory gearing up for transition to 128-layer 3D NAND
2018-11-14
CPU shortages to continue into 2Q19, says Asustek CEO
2018-11-14
Samsung Launches First Mobile SoC with AI-Accelerating Matrix Multiplication Cores
2018-11-13
iPhone XR shipments to reach 70 million units during new product lifecycle
2018-11-08
Global heavyweight clients touting adoption of TSMC 7nm node
2018-11-08
China smartphone shipments to fall in 4Q18
2018-11-07
China smartphone AP shipments set to decline in 4Q18
2018-11-07
Global tablet shipments make gains in 3Q18
2018-11-05
Global semiconductor sales increase in 3Q18, says SIA
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Qualcomm to build three technology, testing centers in Taiwan
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GLOBALFOUNDRIES Introduces Avera Semi

 

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Update: 07-10 17:37,Data has delay
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