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Nvidia's new consumer desktop PC chip reportedly delayed well into 2026  25/07/17
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Kioxia Sampling UFS Ver. 4.1 Embedded Flash Memory Devices  25/07/11
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According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
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2018-03-30
ChinaFlashMarket will suspend HK market quotation in March 30th and April 2nd
2018-03-29
Global semiconductor revenues increase 21.7% in 2017, says IHS
2018-03-29
Acer Unveils the Chromebook Tab 10
2018-03-28
Inventec striving to cut costs
2018-03-28
Foxconn Acquires Belkin for $866 Million in Cash
2018-03-27
In the second half of 2017, vendors will mass-produce 64-layer/72-layer 3D NAND products and will start to develop the 96-layer QLC in 2018
2018-03-27
HTC reports record quarterly losses for 4Q17
2018-03-26
Under the pressure of high-cost procurement, eMCP is the mainstream solution for low-end mobile phones
2018-03-23
Samsung intros 10nm AP for high-end smartphones
2018-03-23
Galaxy S9+ materials cost US$43 more than previous versions, says IHS Markit
2018-03-23
In 2017, the global consumer SSD market shipped 135 million units, an increase of 22% over 2016
2018-03-22
Apple to enter trial production of new iPhone series in 2Q18, say sources
2018-03-21
Asustek likely to make breakthrough in smartphone market
2018-03-20
ODMs mulling price hike, says Compal president
2018-03-20
Compal raises capex sharply for 2018

 

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