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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
Samsung also said on Thursday that its HBM capacity for next year has already been sold out and it was receiving additional order requests.
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2020-05-26
MediaTek has not promised chip supply to Huawei yet
2020-05-26
Samsung Elevates Data Protection for Mobile Devices with New Security Chip Solution
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Update: 11-07 06:32,Data has delay
Samsung KRW 99200 -1.39%
SK Hynix KRW 593000 +2.42%
KIOXIA JPY 11500 +9.06%
Micron USD 238.330 +0.35%
WDC USD 163.600 +2.19%
SanDisk USD 207.690 -4.07%
Nanya TWD 148.0 +7.25%
Winbond TWD 59.0 +5.36%
Phison TWD 1160 +6.91%
SMI USD 95.370 -3.43%
Maxio CNY 55.07 +2.00%
ASolid TWD 72.6 +2.98%
Longsys CNY 268.80 +3.78%
Seagate USD 278.470 +0.98%
Innodisk TWD 455.0 +3.06%
Transcend TWD 135.0 +4.65%
A-DATA TWD 192.5 +2.94%
PENG USD 21.610 -2.66%
Netac CNY 29.50 +0.51%
BWCC CNY 128.00 +2.48%
Techwinsemi CNY 247.14 +10.00%
DAWEI CNY 28.07 +1.34%
OSE TWD 48.40 +1.04%
PTI TWD 170.0 -1.45%
JCET CNY 39.69 +2.08%
ASE TWD 234.0 -0.43%
TFME CNY 41.62 +3.64%
HT-tech CNY 11.96 +1.01%