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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
Samsung also said on Thursday that its HBM capacity for next year has already been sold out and it was receiving additional order requests.
Samsung Electronics Supplies SSDs for Nvidia’s DGX Spark Supercomputer  25/10/29
The PM9E1 is Samsung Electronics’ industry-leading PC SSD in terms of performance and capacity, with sequential read and write speeds of up to 14.5 gigabytes (GB) per second.
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2018-12-13
Intel Launches B365 Express Chipset on 22nm Process, Possibly a Re-branded Z170
2018-12-12
TSMC to expand 8-inch fab capacity for robust demand for automotive, IoT
2018-12-12
NAND flash price rebound to be short-lived
2018-12-11
Notebook ODMs see low order visibility for 1H19 on Intel CPU shortages
2018-12-11
MediaTek revenues fall to 9-month low in November
2018-12-11
China court bans sales of older iPhone models in Apple-Qualcomm global battle
2018-12-07
New Qualcomm chip to power smartphones slated for launch in 1H19
2018-12-07
TSMC to build new 8-inch fab capacity
2018-12-07
Intel 7nm EUV Node Back On Track, 2x Transistor Densities Over 10nm
2018-12-06
US telecom operators to roll out 5G services in 1Q19, says Qualcomm president
2018-12-06
Samsung Display to shift one 8.5G LCD fab for QD-OLED panels in mid-2019
2018-12-05
ASML says fire at supplier Prodrive will lead to delays early next year
2018-12-05
Global semiconductor sales increase in October, says SIA
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Qualcomm intros 7nm, 5G-ready chip
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New product launches drive double-digit growth in wearable market, says IDC

 

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Update: 11-06 19:26,Data has delay
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