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2024-07-03
Samsung applies molybdenum in Gen 9 V-NAND
2024-07-02
Micron Aims for 25% HBM Market Share by 2025 Amid Intense Competition
2024-07-01
Japanese Electronics Component Shipments Soar to 2.5-Year High
2024-07-01
Micron Technology Enters High-End Memory Market, Introducing New Competition for Samsung and SK Hynix
2024-06-28
Tokyo Electron's Ambitious $10 Billion Investment Plan
2024-06-28
Apple Develops New Technology to Simplify iPhone 16 Battery Replacement
2024-06-27
South Korea Invests $200 Million in Semiconductor Packaging R&D
2024-06-26
Samsung and SK Hynix Begin Immersion Cooling Tests for Semiconductors
2024-06-26
Foxconn Subsidiary Expects AI Servers to Contribute Significantly to 2024 Revenues
2024-06-26
Samsung Subsidiary Semes Develops ArF-i Photoresist Coater/Developer
2024-06-24
TSMC and Creative Electronics Secure SK Hynix's HBM4 Chip Mega-Order
2024-06-24
Japan's PCB Production Continues to Shrink, but Revenue Decline Marks the Smallest in 18 Months
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SK hynix Achieves 56% Yield in 3D DRAM
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TSMC's 3nm Process Technology Wins Favor from Seven Major Manufacturers

 

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Update: 12-14 08:32,Data has delay
Samsung KRW 108900 +1.49%
SK Hynix KRW 571000 +1.06%
KIOXIA JPY 9890 +2.91%
Micron USD 241.140 -6.70%
WDC USD 176.340 -5.80%
SanDisk USD 206.180 -14.66%
Nanya TWD 162.0 +3.85%
Winbond TWD 74.6 +9.06%
Phison TWD 1125 +1.81%
SMI USD 87.710 -5.95%
Maxio CNY 46.46 +2.24%
ASolid TWD 69.3 +1.17%
Longsys CNY 265.55 +2.53%
Seagate USD 287.640 -6.56%
Innodisk TWD 500 +5.71%
Transcend TWD 181.5 +4.31%
A-DATA TWD 185.5 +1.92%
PENG USD 20.840 -4.54%
Netac CNY 26.73 +0.49%
BWCC CNY 116.67 +1.08%
Techwinsemi CNY 214.69 -1.11%
DAWEI CNY 26.44 -2.07%
OSE TWD 50.9 +9.82%
PTI TWD 162.0 0.00%
JCET CNY 36.82 +1.13%
ASE TWD 243.5 -0.41%
TFME CNY 37.18 +1.28%
HT-tech CNY 11.01 +1.38%