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2025 Global Memory Market Summary and 2026 Outlook　 25/12/12
CFM (ChinaFlashMarket) has recently released its annual report, "2025 Global Memory Market Summary and 2026 Outlook". The report analyzes market changes and future development from perspectives including market size, capacity, prices, supply, technology, demand, and applications. Welcome to access it. For more report inquiries, please contact: Service@chinaflashmarket.com.
SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM　 25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out　 25/11/06
Samsung also said on Thursday that its HBM capacity for next year has already been sold out and it was receiving additional order requests.
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2019-07-09
Apple to launch three OLED iPhones with 5G alongside budget model in 2020, analyst predicts
2019-07-01
Japan hits South Korea with semiconductor sanctions
2019-06-29
US President Allows U.S. Sales to Huawei as Trade Talks Resume
2019-06-26
U.S. Companies Find Legal Ways Around Trump’s Huawei Blacklist
2019-06-25
Fire at Toshiba Factory to Benefit Korean NAND Flash Makers
2019-06-25
Galaxy Fold delay won’t affect Galaxy Note 10 launch: Samsung
2019-06-20
Premium Smartphone Market Collapses in Q1 as Apple Shipments Fall: Counterpoint
2019-06-19
PCI-SIG Announces PCIe 6.0 Specification
2019-06-18
Why Did Intel Choose Samsung Electronics as Its Foundry Service Provider Instead of TSMC?
2019-06-18
TSMC officially announces R&D for world’s first 2nm process
2019-06-18
Apple will release two iPhones with 5G in 2020, top analyst says
2019-06-17
GigaDevice Launches New Generation of High-Speed Quad and xSPI Compliant Octal SPI NOR Flash
2019-06-14
UMC expects 2019 growth to be on par with industry average
2019-06-14
Hedge fund Third Point calls on Sony to spin off semiconductor unit
2019-06-11
Samsung bags Qualcomm Snapdragon 865 chip orders ahead of TSMC

 
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Update: 12-17 11:46,Data has delay
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SK Hynix KRW 536000 +1.13%
KIOXIA JPY 9247 +6.43%
Micron USD 232.510 -2.10%
WDC USD 174.575 +1.47%
SanDisk USD 209.310 +3.69%
Nanya TWD 164.5 +4.11%
Winbond TWD 73.5 +4.11%
Phison TWD 1100 +5.26%
SMI USD 85.500 -1.80%
Maxio CNY 43.53 -1.05%
ASolid TWD 67.9 +2.41%
Longsys CNY 245.18 +1.98%
Seagate USD 288.130 +0.89%
Innodisk TWD 504 +4.67%
Transcend TWD 182.5 +7.35%
A-DATA TWD 194.0 +8.08%
PENG USD 19.690 -2.43%
Netac CNY 24.80 -1.31%
BWCC CNY 108.28 +1.44%
Techwinsemi CNY 200.40 +0.45%
DAWEI CNY 24.50 +0.25%
OSE TWD 51.6 +5.85%
PTI TWD 164.0 +5.47%
JCET CNY 35.32 -0.17%
ASE TWD 229.5 +0.22%
TFME CNY 35.46 +0.48%
HT-tech CNY 10.54 0.00%