Recommended Hot News
Samsung Electronics Targets 3.25TB/s for HBM4E by 2027　 25/10/15
Samsung Electronics presented a target pin speed of over 13Gbps for HBM4E, which is under development for 2027. HBM4E has 2,048 pins for data transfer, which translates to 3.25TB/s when converted to bytes (1 byte equals 8 bits). Simultaneously, Samsung Electronics stated that the power efficiency of HBM4E would be more than twice that of the current HBM3E, which is 3.9 picojoules (pJ) per bit.
Notice of National Day Holiday　 25/09/30
Due to the National Day holiday, Chinaflashmarket will postpone market quotation from Oct. 1st to Oct. 8th , and all product quotations will resume on Oct. 9th.
Kioxia developing 100 million IOPS SSD for Nvidia　 25/09/16
Kioxia is working with Nvidia to build extremely fast AI SSDs to augment high-bandwidth memory (HBM) by being directly connected to GPUs, with 2027 availability.
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2020-12-24
Xiaomi Mi 11 will be the first Snapdragon 888 phone, and it launches very soon
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U.S. blacklisting of SMIC to badly affect production capacity: company
2020-12-21
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Microsoft may be developing its own in-house ARM CPU designs
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2020-12-18
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2020-12-15
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2020-12-09
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Update: 10-16 08:46,Data has delay
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SK Hynix KRW 429500 +1.66%
KIOXIA JPY 6820 +7.92%
Micron USD 191.940 +2.61%
WDC USD 120.440 +6.46%
SanDisk USD 144.300 +13.36%
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Winbond TWD 40.00 -1.72%
Phison TWD 782 +0.13%
SMI USD 92.645 +4.40%
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