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Samsung in Talks with Broadcom to Supply 12-layer HBM3E, Estimated Volume Reaches 1 Billion Gb  25/07/04
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
Samsung 6th-Gen DRAM Receives Production Readiness Approval  25/07/02
Samsung Electronics achieved a significant technological milestone by securing production readiness approval for its sixth-generation DRAM technology.
SK hynix considering building new back-end process plant in S. Korea  25/06/24
SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
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2020-06-03
Canadian telcos tap Ericsson, Nokia for 5G gear, ditching Huawei
2020-06-03
PC shipments to dip 7% to 367.8 mn units in 2020: Canalys
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Chip maker SMIC plans to raise US$2.8 billion on Shanghai’s Star Market as US moves to stifle China’s tech ambitions
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2020-06-01
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Semiconductor industry lobbies for billions – WSJ
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ASML ships first-generation multibeam inspection system ‘eScan1000’
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Marvell Technology Group Ltd. Reports First Quarter of Fiscal Year 2021 Financial Results
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TSMC Delivers World-first 7nm Automotive Design Enablement Platform
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Apple’s iPhone 11 Sells 5 Times More than Samsung Galaxy S20+
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Update: 07-07 01:04,Data has delay
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