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SK Hynix is reportedly planning to enhance the competitiveness of its 1C DRAM  25/11/06
According to a source in the semiconductor industry cited by South Korean media DDaily, SK Hynix will develop a specific plan for facility adjustments and equipment deployment to introduce the 1c DRAM process after optimizing the production line centered on HBM3E.
Samsung says next year’s HBM capacity already sold out  25/11/06
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2018-04-25
Worldwide semiconductor revenues increase 21.6% in 2017, says Gartner
2018-04-23
HTC adopts two-prong strategy to ramp up performance
2018-04-23
Global semiconductor packaging materials market reaches US$16.7 billion in 2017
2018-04-23
TSMC may post record profits for 2018 on 7nm volume production
2018-04-20
TSMC cuts revenue outlook for 2018
2018-04-20
ZTE protests 'unfair' US penalty, says it's seeking solution
2018-04-20
Rising component and material costs to put pressure on gross margin
2018-04-19
China's ZTE removed chief compliance officer before U.S. sanction: source
2018-04-18
Samsung smartphone market shares in China, India dwindling
2018-04-18
Nanya expects DRAM bit shipments to rise 48% in 2018
2018-04-17
MediaTek 2Q18 revenues likely to rise over 20%
2018-04-17
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2018-04-17
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Chip demand from China handset firms picking up

 

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Update: 11-10 11:02,Data has delay
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Micron USD 237.920 -0.17%
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