According news, the semiconductor market in the third quarter is not busy season is a foregone conclusion, however, Apple will launch the second half of the Macbook Air, iPhone 4S, iPad 3 and other new products, product specifications, certification has been completed, according to industry pointed out that Apple has asked the chip suppliers began stocking, late August is expected to start procurement action.
Eat apple direct or indirect orders of the semiconductor plant, such as TSMC, ASE, Chipbond, Xin Quan, Anen, King Master, etc., better than expected third quarter performance of the industry.
European debt chain explosion, the United States in addition to slow economic recovery, the recent public debt ceiling has not yet been resolved, resulting in sluggish sales of electronic products, including notebooks, feature phones, consumer electronics products, shipments of fear of the third quarter as expected, even intelligent phones and mobile devices such as tablet PCs, shipments, all showed growth stagnation, thereby affecting the second half of the semiconductor market.
As electronic products shipments as expected, both TSMC and UMC recently came under the revised third quarter wafer shipments quarter growth rate of the news, TSMC's wafer shipments in the third quarter growth rate of fear of less than 5 % UMC at best only with the second quarter were flat, of course, back-testing and packaging plant of the season outlook also fell flat, the entire semiconductor market is not busy season is a foregone conclusion.
However, in looking at the market a bad sound, there are still good news came. That Apple will launch the second half of the Macbook Air, iPhone 4S, iPad 3 and other new products, will begin a new round of chip procurement. According to the official pointed out, Apple introduced a new product to the second half, has completed the development of the chip specifications and certification, recently has begun to inform the chip suppliers began stocking the fastest starts in late August procurement action.
Taiwan's semiconductor plant directly into Apple's supply chain industry, not many in the Mac book Air part of the beneficiaries including the provision had the Realtek Ethernet communication chips, provides BIOS NOR flash memory with Macronix, card reader chip supply Business Genesys, power management chip supplier Richtek and so on.
In the iPhone 4S and iPad 3 parts, Taiwan supplier of direct benefit only to provide P- Gamma/Vcom chip Anen, flip chip die size substrate (FCCSP) of the King Master and the remaining are indirect OEM business opportunities, such as 3.5G baseband chip provides the high-pass, orders TSMC and ASE, TI provides power management chips, then appointed by the Ardentec test, while Japan's Renesas is a LCD driver IC suppliers, packaging and testing orders for delivery to the Qi State OEM.
Analysts pointed out that because Apple Gao Ying HTC, fell Android platform product momentum, so the second half of Apple's new product sales performance is expected to better than expected.