TSMC, renowned for its cutting-edge semiconductor manufacturing, has received a significant order from Intel for the 3nm process technology, anticipated for the production of the upcoming Core Ultra 200 series processors. This decision by Intel highlights the company's confidence in TSMC's 3nm capabilities and could shape the trajectory of their partnership moving forward.

Intel has previously detailed the Lunar Lake series processors, designed specifically for low-power platforms and set to be part of the Core Ultra 200 series alongside the Arrow Lake series. Intel has confirmed that both modules of the Lunar Lake processors will be manufactured by TSMC, with the computing module utilizing the N3B process and the platform control module using the N6 process. While the architectural details of the Arrow Lake series are not fully disclosed, recent information suggests that TSMC has commenced production of chips for Intel's new notebook processors using the 3nm EUV FinFET process, potentially including some computing modules for both the Lunar Lake and Arrow Lake series.

The market has shown considerable interest in Intel's choice of TSMC's 3nm process, raising questions about Intel's own foundry business. According to previous leaks, the Arrow Lake series is expected to feature a GPU module manufactured using TSMC's 3nm process, based on the Xe-LPG+ architecture, which is half a generation behind the Xe2 architecture used in the Lunar Lake series. Additionally, the Arrow Lake series is anticipated to include an NPU designed to meet Microsoft's Copilot+ AI PC requirements, which may share the same architecture as Lunar Lake, although its scale remains undetermined.

Intel may combine modules using both its own Intel 20A process and TSMC's N3 process for the Arrow Lake series. This not only represents a technical choice but also reflects Intel's appreciation of TSMC's advanced process technology while considering the development of its own foundry business.

TSMC's 3nm process technology is widely recognized in the industry as one of the most advanced semiconductor manufacturing technologies currently available. Intel's selection of TSMC for 3nm process foundry services not only provides robust technical support for its upcoming processor products but also further solidifies TSMC's leading position in the global semiconductor manufacturing field. With the launch of the Core Ultra 200 series processors, the market eagerly anticipates the performance breakthroughs and technological innovations these advanced process products will bring.