According to South Korean media reports, Samsung Electro-Mechanics has set an ambitious goal to enhance its presence in the high-performance semiconductor substrate market by increasing the sales of its advanced FCBGA substrates, which are crucial for servers, personal computer (PC) central processing units (CPUs), and graphics processing units (GPUs) that demand high performance and dense circuit connections.

With the rapid development of next-generation technologies such as artificial intelligence and server infrastructure, the demand for high-end semiconductor substrates is expected to nearly double from 4.8 trillion KRW (approximately 36.3 billion USD) in 2024 to 8 trillion KRW (approximately 60.5 billion USD) by 2028. Samsung Electro-Mechanics has committed to increasing the sales of these advanced FCBGA substrates to account for over 50% of its total sales and to secure a growing number of orders.

The company successfully began mass production of server FCBGA products in Korea in October 2022 and, in July of this year, secured a supply contract with AMD to provide FCBGA substrates for high-performance computing in servers.

Samsung Electro-Mechanics highlighted that compared to PC products, the area of server FCBGA substrates is more than four times larger, and the number of layers is more than double, exceeding 20 layers, necessitating specialized manufacturing techniques to ensure product reliability and yield. To solidify its position in the high-value market, the company has invested approximately 2 trillion KRW (about 15.1 billion USD) in building advanced high-end production facilities in Busan, South Korea, and Vietnam.

This strategic move by Samsung Electro-Mechanics underscores the company's dedication to innovation and its commitment to meeting the growing demands of the high-tech industry, positioning itself as a key player in the semiconductor substrate market for years to come.