According to a report by Taiwan's Economic Daily, TSMC's A16 process technology, which is set to be the company's most advanced node to date, has secured its first customers. Apple, a long-standing partner of TSMC, has already reserved capacity for the initial batch of production. Additionally, OpenAI, a leader in AI technology, has placed an order for its AI chips, marking a significant step in the AI chip manufacturing domain.

The A16 process incorporates next-generation Nanosheet nanosheet GAA transistor technology and is the first TSMC process to feature the Super Power Rail (SPR) backside power supply solution. TSMC claims that the backside contact technology used in the A16 process maintains the same gate density, layout footprint, and component width adjustability as traditional front-side power supply, making it particularly suitable for high-performance computing (HPC) products.

In the AI chip sector, OpenAI collaborates with two major custom ASIC design companies, Broadcom and Marvell. It is anticipated that OpenAI could become one of Broadcom's top four clients. Regarding the process technology, it is expected that OpenAI's custom AI chips will be manufactured using TSMC's 3nm series processes and the upcoming A16 process.

This development highlights the growing demand for advanced semiconductor processes in the AI industry and the strategic partnerships being formed to meet the technological challenges of the future. With Apple and OpenAI leading the charge, TSMC's A16 process is poised to play a crucial role in the next generation of AI and high-performance computing solutions.