Taiwan Semiconductor Manufacturing Company (TSMC) has recently announced its next steps in the field of advanced packaging technology. TSMC Vice President Jun He highlighted the importance of fusing AI chip memory and logic chips using 3D IC technology, predicting that by 2030, the global semiconductor industry's market value could reach one trillion US dollars. High-Performance Computing (HPC) and Artificial Intelligence (AI) are expected to lead the market, accounting for 40% of the market share.

TSMC is set to launch its 2.5D CoWoS technology by 2027, which will integrate eight A16 process chips and twelve HBM4 memories. The application of this technology will significantly reduce the production costs of AI processors and provide engineers with greater convenience, allowing them to write new code directly into the chips. Additionally, manufacturers are converting SoC and HBM architectures and reducing the cost of mass production to nearly a quarter of the original.

Despite these advancements, increasing the production capacity of 3D IC technology remains a significant challenge, as the size of the chips and the complexity of manufacturing are decisive factors. As chip sizes increase and more chip blocks are added, performance is enhanced, but the process becomes more complex, accompanied by a higher risk of alignment errors, breakages, and extraction failures.

To address these challenges, TSMC has adopted automated and standardized tools, process controls, and quality instruments, as well as a 3DFabric manufacturing platform. 3DFabric is a unique, fully integrated solution that ensures stronger builds by optimizing the use of 1,500 different material types in the supply chain.

Collaborating with up to 64 suppliers, TSMC produces advanced packaging tools such as high-resolution placement tools and AI-driven quality control. These collaborations will help TSMC maintain its leading position in packaging technology innovation and production.