Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly reached a significant milestone in its Arizona facility, where trial production of N4 node wafers has yielded results on par with its facilities in Taiwan. This achievement, following a multi-month effort to produce wafers with low defect rates, is a testament to the success of TSMC's expansion into the United States.

According to a report by Bloomberg, TSMC's Arizona facility has reached yield parity with its Taiwanese counterparts, a crucial benchmark in the complex process of advanced chipmaking. This process is only undertaken by a select few manufacturers in limited locations globally. The successful trial production, with wafers now undergoing testing in TSMC's labs, paves the way for the company to start volume production in the first half of 2025.

The Arizona facility is just the beginning of TSMC's ambitious expansion plans in the US. The Taiwanese semiconductor giant aims to have a second fabrication plant operational by 2028, focusing on the production of 2 nm and 3 nm chips. Additionally, a third facility is in the works for 2 nm and more advanced nodes in Phoenix, bringing the total investment value of TSMC's US expansion efforts to a staggering $65 billion. This includes $6.6 billion from the CHIPS Act grants and $5 billion in loans from the US government.

If subsequent fabs follow the successful blueprint of the first facility, it is likely that the US-based production needs will be adequately met, further solidifying TSMC's presence and contribution to the semiconductor industry in North America.