Powerchip Technology expects the contribution to revenues of its PC DRAM business to fall to 20% or even less in 2012, in line with the company's diversification strategy, according to chairman Frank Huang.
Powerchip is dedicating more efforts to the production of its in-house developed NAND flash, and foundry services, said Huang. In particular, efforts to expand the company's flash business will be given top priority, Huang noted.
Powerchip offers NAND chips ranging in densities from 1Gb to 32Gb. 40nm is now Powerchip's major production node for the NAND products, and the company is set to move a newer 28nm process to volume production in 2012.
Production for NAND flash accounts for 10% of Powerchip's overall capacity at present. The proportion will climb significantly to 20-25% in 2012, according to Huang.
As for PC DRAM, the ratio to company capacity will slip to 15-20% in 2012 from the current 30%, Huang said.
Powerchip intends to keep a portion of its capacity for DRAM as it will continue developing products using advanced technologies, such as 3D TSV (through-silicon via), Huang pointed out.
Companies should start making DRAM using 3D TSV technology during 2013 and 2014, and Powerchip is also looking to participate, Huang added.
Powerchip also provides foundry services for LCD driver ICs, CMOS image sensors, power management chips, specialty DRAM and NOR chip products. The segment accounts for 60% of company production and will stay at the same ratio in 2012, Huang added.