Winbond Electronics has announced it will begin 40nm development in 2010, according to company president Chan Tung-Yi. The company declined to comment on whether it will cooperate with Elpida Memory in 40nm production.
Winbond's capex for 2010 is NT$6.7 billion (US$2009.15 million), a 50% increase compared to NT$4.2 billion of 2009, and includes expenses for 40nm development.
The company plans to increase capacity at its 12-inch fab to 34,000 wafers per month from the current 32,000. It will also expand monthly capacity for NOR flash products from 4,000 to 6,000 wafers, the company added.