Elpida Memory is set to complete its 30nm process technology transition in October 2012, despite having filed for bankruptcy.

Elpida now has all of its in-house capacity for mobile DRAM memory built using 30nm process technology, according to industry sources. As to mainstream 4Gb DDR3 chips, Elpida's entire output for the segment will be 30nm made in October, the sources indicated. Such development will help the Japan-based chipmaker reduce production costs further.

Rexchip Electronics, the Taiwan-based production subsidiary of Elpida, has also completed equipment upgrades. Rexchip will be able to output chips – all made using 30nm process technology – also in October 2012, the sources revealed.

Elpida's Hiroshia plant now mainly fulfills mobile DRAM orders placed by Apple, the sources pointed out. Monthly production at the facility is estimated at about 80,000 12-inch wafers, the sources said.

Rexchip, contracted exclusively by Elpida to manufacture commodity products, runs a 12-inch wafer fab with monthly capacity of 80,000 units. Rexchip reportedly has scaled down its monthly output to about 60,000 units as it strives to reduce cash outflow.

In other news, Rexchip has reported net losses of NT$5.47 billion (US$182.8 million) for the first half of 2012, compared to profits of NT$2.37 billion a year ago. Revenues saw a 23.55% decrease during the same period.