MediaTek's launch of its quad-core MT6589 smartphone solution will push China-based smartphone vendors to accelerate the development of high-end models, and therefore boost demand for multi-layered HDI boards, according to industry sources.

China-based smartphone makers currently are using single-side HDI boards for the production of smartphones when utilizing MediaTek's MT6573 and MT6575 solutions, and using double-layered HDI boards when adopting the MT6577 solutions, the sources indicated.

Along with growing demand for high-end models, China-based smartphone makers have increased the adoption of multi-layered HDI boards, and the launch of MediaTek's quad-core solutions will give a boost to the trend, the sources commented.

The proportion of smartphones rolled out by Huawei Device and ZTE with multi-layered HDI boards is expected to reach 20-30% of their total production in 2013 compared to a ratio of 10% in 2012, the sources estimated.

Taiwan-based PCB makers including Unimicron Technology, Compeq Manufacturing, Unitech Printed Circuit Board and Zhen Ding Technology Holding are focusing on the production of high-end HDI boards, with models delivered in three-layer and above making up over 50% of their total production.

Tripod Technology is currently concentrating on the production of single-side and double-layered HDI boards for China-based smartphone makers, but can also roll out multi-layered products based on customer demand, said the company.