Nanya Technology plans to ramp up wafer starts at its 12-inch fab from the current 30,000 units to 50,000 units by year-end 2010, according to Jih Lien, president of Taiwan's largest DRAM maker by revenues. Lien also revealed Nanya's decision to raise 2010 capex to NT$20-25 billion (US$624.22-780.27 million), up from an original goal of NT$19 billion.
Lien's remarks confirmed a January 21 report which cited industry sources saying Nanya was mulling plans to expand 12-inch wafer capacity, and also to revise upwards its capex budget for this year.
Nanya has been running its 12-inch fab at full capacity since the beginning of March, processing 30,000 wafer starts using 68nm process technology, Lien said. He expects half of Nanya's monthly capacity will be made using 50nm starting from the second quarter.
In addition to its migration to more advanced processes, Nanya now plans to also carry out a capacity expansion project at its 12-inch fab by the end of this year, Lien said. Accordingly, Nanya will be able to ramp capacity at its 12-inch fab to 50,000 wafers a month, said Lien.
Nanya also plans to recruit 250 new employees, according to Lien. The DRAM maker now has 4,000 employees.
Lien delivered a rosy outlook for DRAM, saying demand is improving and will be strong in 2010.