Market watchers are more optimistic about the IC packaging and testing business in the second quarter of 2013, judging from a rosy outlook provided by TSMC for the quarter. Sales at major IC packagers including Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) are forecast to enjoy 15-17% revenue growth sequentially in the second quarter.

TSMC has forecast a 16-17.5% revenue rise for the second quarter, which beat market estimates of single-digit growth. TSMC credited its optimistic guidance to strong demand for mobile devices and 28nm process technology.

ASE and SPIL will also benefit from a ramp-up in demand for mobile chips, the watchers indicated. As upstream IC firms including Qualcomm, MediaTek and Spreadtrum step up their pace of orders, the two major backend houses are likely to provide a positive outlook for the second quarter, the watchers said.

For all of 2013, ASE and SPIL are expected to see their performance outperform that of foundry chipmakers, the watchers believe.

TSMC chairman and CEO Morris Chang remarked at the company's quarterly investors meeting on April 18 that TSMC's growth forecasts for the foundry and the overall semiconductor sector for 2013 have been revised to 10% and 4%, respectively, from 7% and 3%.

ASE and SPIL are scheduled to detail their operations in the first quarter of 2013 and guidance for the second quarter at their respective investors meetings on April 26 and 30.