ProMOS Technologies has started trial runs on 63nm for Elpida Memory DDR3 products, while Rexchip Electronics is set to significantly ramp up chip production using the same node prior to a process shift to 45nm, according to industry sources.
The sources revealed that ProMOS has quietly moved up its schedule to enter trial production based on Elpida's process technology. The Taiwan-based DRAM maker is expected to start mass production on 63nm for Elpida's DDR3 memory in the second half of 2010, and by the end of the year its monthly output for the chip is estimated at 35,000 wafer starts.
In late 2009, Elpida and ProMOS inked a DRAM foundry agreement under which Elpida would provide ProMOS with advanced process technologies in exchange for the Taiwan partner's capacity for the manufacture of its DDR3 chips.
For Rexchip - Elpida's production subsidiary in Taiwan - its production schedule for sub-50nm chips has been delayed by longer-than-expected delivery time of immersion scanners needed for the process, the sources indicated. Rexchip was originally set to start producing chips on 45nm in the second quarter.
The sources pointed out that Rexchip has decided to expand output of its DDR3 chips using Elpida's 63nm, while queuing up to receive immersion equipment for its planned technology transition to sub-50nm. Rexchip is scaling up its monthly output on 63nm, aiming to reach 50,000-60,000 wafer starts from 20,000 originally.
Delivery for immersion tool orders that Rexchip has placed will not begin until May, according to the sources.
Elpida's 63nm process is expected to lower ProMOS's and Rexchip's production cost for 1Gb DRAM to US$1.5-1.6, and migrating to the 45nm node will allow a further drop to US$1.2-1.3, the sources indicated.
Spot market prices for 1Gb DDR2 chips and same-density DDR3 have recently gone up to top US$3.