IC demand for mobile devices particularly smartphones is expected to drive revenue growth at packaging and testing houses Siliconware Precision Industries (SPIL) and King Yuan Electronics Company (KYEC) in the third quarter of 2013, according to industry sources.

　　SPIL with its wafer-level packaging (WLCSP) and 12-inch gold bumping services has secured new orders for handset chips and peripheral ICs from Qualcomm, with shipments already kicking off in June, the sources indicated.

　　In addition, SPIL's shipments to its major client AMD will see a seasonal pickup as mass shipments of AMD's chips for new games consoles start, the sources said. SPIL will also enjoy a pull-in of orders for power management ICs from Dialog Semiconductor during the third quarter, the sources added.

　　However, SPIL's performance during the first part of the third quarter could be affected negatively by a slowdown in orders from MediaTek and Spreadtrum Communications as the two clients are engaged in inventory adjustments and transitioning from old to new products, the sources warned.

　　SPIL is expected to report 10-15% growth in consolidated revenues for the third quarter, the sources cited market watchers as predicting.

　　SPIL has announced June consolidated sales of NT$6 billion (US$199 million). Consolidated revenues amounted to NT$17.6 billion for the second quarter of 2013, rising 27.4% on quarter, and beating market watcher estimates of 25-27% sequential growth.

　　Continued strong demand for handset-use chips and LCD driver ICs from Taiwan-based fabless firms will buoy sales at wafer probing service company KYEC in the third quarter, the sources noted.

　　KYEC posted revenues of NT$1.29 billion in June 2013. Sales for the second quarter totaled NT$3.78 billion, up 11.65% sequentially and meeting market expectations.