Memory packaging and testing house Walton Advanced Engineering has prevailed in a lawsuit in Taiwan brought by rival ChipMOS Technologies pertaining to packaging technology used for DDR2 SDRAM devices, according to Walton's company filing with the Taiwan Stock Exchange (TSE).

ChipMOS has said that it will appeal.
ChipMOS in September 2007 filed patent infringement complaints against Walton and its subsidiary Walton Chaintech, accusing them of infringing two of its BGA (ball grid array) package-related patents (patent No. 207627 and 207525, entitled "Substrate on Chip Packaging Process") and one package-related patent (patent No. 177516, entitled "Method for Mounting a Chip for Improving Bonding and Positioning").