Intel has contracted Taiwan Semiconductor Manufacturing Company (TSMC) to manufacture its forthcoming Atom mobile processor series codenamed SoFIA, and also placed orders for entry-level baseband chips with Globalfoundries and United Microelectronics (UMC), according to industry sources.

　　The contract chipmakers declined to comment on customer orders.

　　Intel's SoFIA SoCs designed for entry-level smartphones and tablets will be built using TSMC's 28nm HKMG process technology, said the sources. As for the other series of Atom SoCs codenamed Broxton, Intel will use its 14nm FinFET process to make the chips targeting high-end mobile devices.

　　Intel has also placed orders for entry-level baseband chips with Globalfoundries and UMC, using their respective 28nm PolySiON process nodes, the sources indicated. Initial shipments required by Intel are estimated at 7,000-8,000 wafers monthly.

　　Globalfoundries will first be the primary contract chipmaker for Intel's 28nm baseband chips, the sources noted. Nevertheless, Intel is likely to release more orders to UMC later in 2014 when the Taiwan foundry improves its 28nm production yield rates, the sources said.