TSMC's revenues generated from the mobile device sector are expected to increase more than 35% in 2014, buoyed by the rising popularity of smartphones and tablets, and rising silicon content per device, said company chairman Morris Chang at a January 15 investors meeting.

　　Mobile devices that incorporate 64-bit processors and come with support for multi-mode networks will become widely available in 2014, said Chang. Meanwhile, more devices will include MEMS and NFC, feature new standards in Wi-Fi and Bluetooth, and have fingerprint recognition capabilities. The continued performance improvements and feature enhancements will boost the amount of silicon inside a system, Chang indicated.

　　Mobile products will be the key growth engine for TSMC in 2014, when the company expects to post double-digit revenue growth, Chang noted. In terms of technology, TSMC's 20nm SoC and 28nm HKMG process nodes will fuel the company's growth in 2014, Chang said.

　　Also at the investors meeting, TSMC co-CEO CC Wei disclosed that shipments of 20nm process technology will reach about 10% of the company's total wafer sales in 2014. The foundry has moved the node to volume production in the first quarter.

　　As for TSMC's 16nm FinFET process, the node will be ready for mass production in 2015, company co-CEO Mark Liu indicated.