Contact image sensor (CIS) module supplier Asia Tech Image has extended operation to COB (chip on board) packaging of smartphone compact camera modules (CCMs) and will start shipments as soon as the end of second-quarter 2014, according to Chinese-language Economic Daily News (EDN).

　　Targeting vendors of high-end smartphones in the China market, Asia Tech Image aims to ship 20 million COB-packaged CCMs in 2014, EDN indicated, adding the company aims to ship 25.3-26.4 million CIS modules in 2014.

　　The firm has invested NT$300-500 million (US$10-16.7 million) to set up COB packaging capacity in Taiwan and a CIS module factory in Myanmar, EDN said. The Myanmar factory will have a monthly production capacity of three million CIS modules in first-half 2014 and of five million in the second half, EDN noted.