NOR flash suppliers Macronix International and Winbond Technology are both expected to ramp up their shipments of low density 1Gb-4Gb NAND flash chips in 2014 as international players are focusing more on high density MLC and TLC NAND flash products, according to industry sources.

　　Macronix delivered its 4Gb NAND flash chips to clients for verification in the fourth quarter of 2013 and plans to deliver 2Gb models for approval in the first quarter of 2014, according to company president CY Lu.

　　Macronix will avoid direct competition with the industry's top-four, Samsung Electronics, Toshiba/SanDisk, Micron/Intel, and SK Hynix, while focusing on 1Gb-4Gb chips, Lu added.

　　Meanwhile, Macronix also plans to migrate from 75nm process into 55nm for production of NOR flash chips in 2014. Chips produced on 75nm accounted for 26% of Macronix's total NOR flash production at year-end 2013.

　　Windbond is expected to begin volume production of 1Gb NAND flash chips in the second half of 2014, said the industry sources.