Elpida Memory, Powertech Technology (PTI) and United Microelectronics Corporation (UMC) have jointly announced their entry into a 3-way cooperation to advance 3D IC integration technologies for advanced processes including 28nm. This collaboration will leverage the strengths of Elpida's DRAM, PTI's assembly and UMC's foundry logic technologies to develop a total 3D IC integration solution.
Elpida successfully developed an 8Gb DRAM based on TSV technology in 2009, according to company director CTO Takao Adachi. "The joint development that we now plan with UMC means that we can use the most advanced TSV integration technology to bring together our advanced DRAM technology and UMC's leading-edge logic foundry technology including experience in providing SoC solutions such as advanced microprocessors," said Adachi.
By working with PTI, Elpida and UMC will be allowed to deliver a variety of services using TSV technology, Adachi added.
SC Chien, VP and head of advanced technology development at UMC, remarked that the foundry's 28nm, gate-last high-K/metal gate development will be ready to support customer IP verification by the end of 2010. Leveraging UMC's logic technology and logic design interface with Elpida's DRAM/TSV technology and PTI's packaging and testing, Chien said this joint development project will allow his company to offer a total solution for 3D IC designs.
In other news, industry sources have speculated that UMC is mulling plans to form a cross-shareholding partnership with Elpida, in a move to further tighten its partnership with the Japan-based memory chipmaker in the future.
A UMC fund raising plan was recently approved during the company's annual shareholders meeting on June 15. The foundry chipmaker said it is seeking to bring in a strategic partner.