Samsung Electronics reportedly has finished developing an LTE-A modem chip solution, the Exynos Modem 300, and will integrate it into the company's quad-core processors to compete against Qualcomm, according to a Korean-language D-Daily report.

The solution combines two different bands (10+10MHz) and is manufactured through a 28nm HKMG process, supporting both FDD and TDD standards. Samsung also has developed the Exynos RF IC specifically for the solution, the report noted.

The solution has been adopted in the Galaxy Zoom 2, developed jointly by Samsung and Korea-based telecom carrier LG U+, the report added.