Samsung Electronics has developed what it claims is the industry's first 32GB load-reduced, dual-inline memory module (LRDIMM) for server applications, according to the company. Mass production is scheduled to begin in the second half of 2010.
Samsung said the new 32GB LRDIMM is manufactured using its 40nm-class, 4Gb DDR3 chips, and therefore accommodates next-generation servers designed for virtualization, cloud computing and other high-capacity applications.
Samsung added the 32GB LRDIMM prototype consists of 72 4Gb DDR3 chips, and an additional memory buffer chip to help reduce the load on the memory subsystem by as much as 75%.
Samsung claimed that by using 32GB LRDIMMs, memory capacity can rise up to 384GB per CPU. In a two-way server system, capacity can be increased up to 768GB, or about 1.5 times that of a 512GB server system equipped with 32GB DDR3 RDIMMs.
A server equipped with LRDIMMs can process data at 1,333Mbps, approximately 70% faster than the previous speed of 800Mbps, Samsung indicated. Its LRDIMMs operate at 1.35V or 1.5V.