ProMOS Technology has revealed that it will complete the previously-announced sale of its 12-inch wafer fab at the Hsinchu Science Park (HSP), and hand over operation to Macronix International on September 1, 2010.
Macronix has already begun moving in new equipment at the 12-inch fab, ProMOS said, adding that production of its last batch of wafer starts at the facility began in May.
Macronix recently announced plans to invest a total of NT$16.4 billion (US$523 million) in the 12-inch fab, and hire an additional 1,500 employees over the next 2-3 years.
Macronix expects to commence volume production at the 12-inch fab in the first quarter of 2011, the company was quoted in previous reports as saying. The new capacity will contribute 20,000 wafer starts to Macronix's current monthly level, and mainly fabricate high-density ROM and NOR flash products.
Market observers have pointed out that competition among the NOR suppliers is heating up, with Spansion's exit from bankruptcy, and Macronix and Winbond Electronics speeding up their expansion.