Qualcomm will contract both Samsung Electronics and Taiwan Semiconductor Manufacturing Company (TSMC) to manufacture its 1Xnm chips, whereas MediaTek is also likely to have more than one foundry build its high-end solutions in 2015, according to industry watchers.

Judging from tight wafer production capacity and persistent high foundry costs in 2014, Qualcomm, MediaTek and other IC vendors will be eager to look for multiple foundry partners in 2015 as their shipments and performance are likely to be affected by TSMC's supply capacity due to its dominance in the foundry industry, said the sources.

Qualcomm has been seeking to establish cooperation ties with United Microelectronics Corporation (UMC), Semiconductor Manufacturing International Corporation (SMIC), Globalfoundries and Samsung.

Furthermore, Qualcomm has decided to use Samsung's 14nm process as well as TSMC's 16nm process to fabricate its next generation chips, revealed the sources.

Meanwhile, MediaTek is also looking for support from tier-2 foundry houses and will have diverse foundry partners as Qualcomm has, added the sources.