Intel and Micron Technology have announced they have begun sampling what they claim is the industry's highest capacity and smallest NAND device with select customers. The 64Gb 3-bit-per-cell MLC chip, manufactured using 25nm process technology, targets the USB, SecureDigital (SD) flash card and consumer electronics market segments that all require higher capacities at low prices.
Intel and Micron said they expect to be in full production by the end of 2010.
The new 25nm 3-bit-per-cell device is more than 20% smaller than the same capacity of Intel and Micron's 25nm 2-bit-per-cell MLC one. The die measures 131mm2, and comes in an industry-standard TSOP package.
"With January's introduction of the industry's smallest die size at 25nm, quickly followed by the move to 3-bit-per-cell on 25nm, we continue to gain momentum and offer customers a compelling set of leadership products," said Tom Rampone, Intel VP and GM of Intel NAND Solutions Group.
"We are already working to qualify the 8GB TLC NAND flash device within end-product designs, including higher-capacity products from Lexar Media and Micron," said Brian Shirley, VP of Micron's NAND Solutions Group.