It was reported yesterday that the Qualcomm Snapdragon 810 chip was overheating so often that Samsung would not be able to use it with the Galaxy S6. The same chip is present in the LG G Flex 2 which is set to reach South Korea on January 30. Woo Ram-chan, LG VP for mobile product planning, has responded to those overheating reports by saying the Snapdragon 810 runs fine in the G Flex 2.

The VP claims he doesn't "understand why there is a issue over heat." In the G Flex 2, the chip actually performed better and used emitted less heat than the alternatives.

With LG responding to those overheating claims, it seems the heat issue may have more to do with the Galaxy S6 than with the chip itself.