Specifications of Huawei's next-generation mobile chipsets have been leaked. While their new 64-bit Kirin 930 chipset has only been used in one device, the Huawei MediaPad X2, Huawe already has more powerful Kirin mobile processors lined up for 2015.

The Kirin 940 and Kirin 950 chipsets are based off the Kirin 930 chipset. Both new SoCs have 4xCortex A53 cores and 4xCortex A72 cores, with differing max clock frequencies. However, the new Kirin 940 and Kirin 950 chips have support for dual-channel LPDDR4 RAM, which translates to an impressive 25.6GB/s bandwidth.

Huawei is upgrading the GPU from the ARM Mali-T628 in the Kirin 930, to the Mali-T860 GPU in the Kirin 940, and Mali-T880 GPU in the Kirin 950. A new DSP is being used. Also, a dual ISP with 32MP and 42MP sensor support is present the Kirin 940 and Kirin 950 respectively.

Lastly, the Kirin 940 and Kirin 950 chipsets support UFS 2.0 memory standard, in addition to eMMC 5.1 and other standards.

Huawei's tentative release timeframe for Kirin 940 is Q3 2015. For the Kirin 950, that's Q4 2015.