Intel will host its spring Intel Developer Forum (IDF) in Shenzhen, China from April 8-9 with keynotes from company CEO Brian Krzanich, announcements on the company's latest R&D progress, lineup and partnerships in China and covering fields including PCs, handsets, tablets, servers and Internet of things (IoT).

After having hosted the show in Beijing for seven consecutive years, Intel moved IDF in China to Shenzhen in 2014 in order to be closer to the supply chain.

In addition to Krzanich, corporate vice president and president of Intel China Ian Yang; senior vice president, general manager, Intel Data Center Group Diane Bryant; senior vice president, general manager, Intel Client Computing Group, Kirk Skaugen; senior vice president, general manager, Intel Internet of Things Group, Doug Davis and senior vice president, general manager, Intel Software and Services Group, Doug Fisher will also deliver keynotes during the show.

Intel has formed several cooperation agreements with China-based players during the past year including the establishment of the innovation lab with China-based Jingdong and strategic alliance with Spreadtrum and Rockchip. Intel is also planning to invest US$1.6 billion in the next 15 years to upgrade its fab in Chengdu, China and import its Advanced Test Technology into China.

Intel is also expected to showcase its latest CPU platforms including Atom x3 processors (SoFIA) for entry-level smartphones and tablets with phone functions during the show. Vendors such as Asustek Computer, Jolla, Bluebank, BYD, Compal Electronics, Elitegroup Computer Systems (ECS), Emdoor, Foxconn Electronics (Hon Hai Precision Industry), Hamploo, Malata, Pegatron Technology, Quanta Computer, Tsinghua Tongfang, Weibuand Wistron are planning to launch products using the solutions.