Elpida Memory has completed development of a 30nm-class 2Gb DDR3 SDRAM for PCs and consumer electronics products, with sample shipments slated for December 2010. Mass production is also expected to commence later in the month, according to the company.
Elpida said the new 2Gb DDR3 SDRAM uses a smaller chip size to achieve a 45% higher chip yield per wafer compared with its 40nm-class process products.
In addition, Elpida also plans to apply the new 30nm-class process to its mobile RAM products, together with through silicon via (TSV) technology to support one-chip memory solutions for mobile phones, DSCs and PC DRAM, the Japan-based memory chipmaker indicated.
Fellow Korea-based competitor Samsung Electronics kicked off mass production of its 2Gb DDR3 chips using 30nm-class process technology, according to the vendor's announcement in July.