TSMC is set to move its 16nm FinFET Plus (16FF+) process to commercial production in the second half of 2015, and plans to introduce a compact version of the 16FF+ process in early 2016, according to president and co-CEO CC Wei. Total production capacity of the foundry's 16nm FinFET processes at the end of 2016 will triple that a year earlier, said Wei.

TSMC's 16FF+ process has received more than 20 product tape-outs, 10 of which have achieved satisfying yield performance, Wei indicated. By the end of 2015, the number of the tape-outs will top 50 covering different chip products, Wei said.

In addition, TSMC will roll out a compact, lower-power version of its 16FF+ process dubbed 16FFC with volume production scheduled for the second half of 2016, Wei noted. Compared to the 16FF+ process targeted at high-performance chip solutions, the 16FFC will be particularly for price-sensitive mobile devices, and wearable and IoT applications.

As for 10nm FinFET process, TSMC will move the node to commercial production in the second half of 2016, Wei disclosed. The 10nm FinFET process will be in risk production later in 2015, Wei said.